Semi suppliers launch Low-K alliance
13 Jul 2001
Speeding the adoption of low-k dielectrics into advanced fabrication lines, The Dow Chemical Company and nine other semiconductor equipment and materials suppliers have launched an industry-wide alliance to develop compatible, production-ready processes for SiLK semiconductor dielectric resins, the leading low-k dielectric materials for the 130nm technology node and beyond.
Together as the SiLKnet Alliance, members will combine chipmaking expertise to streamline fab processes, develop new, compatible products and expand integration knowledge for SiLK dielectric resins.
Founding alliance members include Arch Chemicals, Ashland Specialty Chemical Company, Dainippon Screen Mfg., EKC Technology, Ferro Corporation, Planar Solutions LLC, Supercritical Systems, Tokyo Electron Limited and Verteq. Discussions with additional suppliers are ongoing.
As the industry adopts advanced low-k materials, IC manufacturers have turned to equipment and materials suppliers to develop compatible chipmaking processes. Members of the SiLKnet Alliance will have access to a pool of blank and patterned/partially processed SiLK-coated wafers, which will be used to develop new equipment, materials and processes for SiLK films.
SiLKnet members will make the technical information from these developments available to customers through links to the SiLKnet Web site (www.silknetalliance.com), being launched this month, and links to individual company Web sites.
Coordination of all SiLKnet Alliance activities will be spearheaded by Greg Bauer, alliance development director, and Michael Simmonds, alliance application development manager, both of Dow. Bauer is responsible for driving the commercial aspects for the alliance, while Simmonds is chartered with the technical components of the program.
SiLKnet is a non-exclusive alliance, open to all suppliers in the semiconductor equipment and materials community.
Editor's note: SiLK resins are a family of spin-on, low-k ILD materials that allow semiconductor manufacturers to increase the speed and performance of their chips by enabling denser circuitry. First generation SiLK resin products offer k=2.6 for both copper damascene and aluminium/tungsten processing. Dow also offers a porous SiLK resin (k=2.0), which is being developed for 100nm chip designs.
