That's a lot of Aerosmith

Thin Film Electronics ASA (TFE) and Intel are to begin developing fabrication processes for polymer memory modules. The companies will also design scalable arrays to take advantage of the new fabrication processes.

The development work by both companies will be conducted at one of Intel's wafer fabrication facilities in Hillsboro, OR. TFE will continue to develop new technology in parallel in its labs in Linkoping, Sweden.

Thin Film Electronics ASA (TFE) is a research and development company owned by both Opticom ASA and Intel itself.

TFE has developed polymers for use in high-density memory devices that, it claims, could be produced at less than 5% of the cost of silicon-based memories. Layers of memory devices may be stacked, and there is also the potential for reel-to-reel production.

The company claims that, in the future, it will be possible to store the equivalent of 400,000 CDs on a polymer memory chip the size of a credit card.