DSM opens PA4T market development plant

Geleen, The Netherlands - DSM has started up a 'market development' plant for PA4T, a new polyamide for use in electronics and other engineering  applications. The plant is based in Sittard-Geleen, where the Dutch group has its worldwide R&D center.

The start up follows customer trials of PA4T, which claims DSM Engineering Plastics, meets market demand for miniaturisation and the convergence of electronics devices such as mobile phones and PCs. The balance of properties also offers metal replacement opportunities to automotive customers seeking better fuel efficiency and lower emissions, the group said.

“We are pleased with DSM addressing the continuous trends in the interconnection industry. Examples of these trends are higher density, increased data speeds, improved dimensional stability and higher soldering temperatures,"said Eric Leijtens, director engineering, Business Unit CC&CE Tyco Electronics Europe, one of the customers involved in testing PA4T. Preliminary tests in products like SIM cards have been promising. Tyco Electronics applauds DSM's efforts to innovate in materials sciences.” 

“The balance of dimensional stability, high mechanical and thermal performance and exceptionally low moisture uptake outpaces any existing polymer ...  [and] enables very high processing speed at competitive costs,” said Roelof Westerbeek, global business director High Performance Polyamides at DSM Engineering Plastics.

According to DSM, PA4T addresses market needs for lead free surface mount devices such as circuit boards used in personal computers, as well as the current move towards halogen-free electronics. In lighting, such as LEDs, DSM expects PA4T to support customer requirements for high reflectivity, high temperature resistance, high mechanical strength and low out gassing.