Visit Balluff at PPMA 2015
5 Aug 2015
With such a high demand to increase productivity and flexibility of machines and processes while maintaining healthy margins, inefficient technology throughout the production line can cause major issues with downtime.
Balluff will be showcasing how I-O Link can change all that on stand F50 at PPMA 2015.
IO-Link is quickly becoming a critical element of the manufacturing environment and forming a strong backbone for industrial networks.
As a founding member of the IO-Link consortium and the market leader in Distributed Modular I/O utilising IO-Link, Balluff offers the most devices available in the market encompassing I/O and connectivity solutions.
Balluff will also be showcasing a variety of technologies including object detection, vision, industrial identification and fluid sensors for the primary, secondary or end-of-line packaging industry.
Its aim is to add value to automated systems by providing a wide range of enabling technologies that unlock hidden productivity potential.
