Silicone gel targets automotive electronics
16 Mar 2005
Applications of the new gel in power electronic devices include forming high-density, multi-layer interconnects capable of withstanding high temperatures and high rates of acceleration.
The new material, EG-3000 silicone gel, is designed to meet the needs of automotive electronics manufacturers who are adopting hybrid circuit designs that must be sealed and protected from harsh, under-the-hood conditions.
The gel’s hybrid LTCC (Low-Temperature Co-fired Ceramic) based technology offers two key advantages: enabling circuit modules to be made smaller and lighter as well as allowing multiple layers of circuitry to be stacked upon each other, thereby achieving higher densities than traditional PC board modules.
EG-3000 has the ability to fully encapsulate individual components without having to cover the entire electronics module housing. Dow says that by using the gel, electronics manufacturers can reduce their material consumption by 30-40% per module, compared to other non-thixotropic dielectric gels on the market today.
The gel also offers the physical and electrical stability required to withstand harsh engine compartment conditions, such as vibrations and temperature extremes.